Barbat low inertial mass generator

[tak22]

@Hans,

Thanks for the validation, but your Correction is too big!

While my research found references saying cupric oxide is a semiconductor, it also found that cuprous oxide is a better one, which explains why it's used most often. I expect it's the simple old case of efficiency (which makes you money), trumps robustness.

@all

That's enough theory searching for me for a while, so I'll continue to proceed with the "build and test" method. My gut feeling is that the Barbat patent is well thought out, and if copper wire works, then it won't matter to me if it's CuO, Cu2O, CuO and Cu2O, superconducting, semiconducting, photoconducting, or voodoo magic. I just want to get to the point where a "special" coil of copper wire is proven to be or not be, "special". If yes, then proceed with testing the gazillions of variations and variables to get something truly remarkable. How's that for positive? 

tak

ps. I've been asked why I feel strongly about this barbat patent. It's a good question and when I can gather more minutes together than I'm finding lately I'll post my thoughts. And I still have my research on how to get a good oxide layer onto copper wire written up.

[Schpankme]

I've been asked why I feel strongly about this barbat patent. It's a good question and when I can gather more minutes together than I'm finding lately I'll post my thoughts. And I still have my research on how to get a good oxide layer onto copper wire written up.

Hey Tak,

Where you at with replication of the Barbat Patent ?

- Schpankme

[tak22]

@Schpankme

thanks for asking, but I'm at one of the frustration stages! I've got pages of research to distill into something sensible and not enough time to get to it. 

got a few more intense days coming up and hoping for a break by Sunday.

tak

[tak22]

CuO cupric oxide update:

I'm continuing with my BARBAT replication using the CuO oxidized wire variation. To proceed, I need some oxidized wire so I spent quite a few hours searching for references. Here are 15 ideas I found for forming a CuO cupric oxide layer on copper wire. Most all of them involve chemicals that are dangerous to work with, so please do your own research before attempting any of these methods. All methods are written by others and many details are lacking, so again, research before proceeding.

I have not attempted any of these yet, so any refinements/corrections/additions suggested are appreciated.

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ABOUT WIRE ANNEALING - When copper wire is annealed with heat in air the wire temperature is around 566 degrees Celsius, and when it is taken above about 200 degrees C, it quickly oxidizes and cupric oxide forms. To protect the hot copper wire from atmospheric oxygen, steam, nitrogen or some other reducing atmosphere is put around it until such time that the annealed copper wire is cooled down. (Preferably back to room temperature.)
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0 - HEAT (from BARBAT) - Alternatively, copper oxides are formed in place on bare copper or bronze wire by heating the wire above about 260? C in an oxygen atmosphere.

1 - 4N-NaOH - The copper was anodically oxidized at 100? C in 4N-NaOH to give a cupric oxide film.

2 - HEATED CAUSTIC OXIDIZERS -- These baths operate at 240? F and utilize caustic soda and sodium nitrate to oxidize the copper at the surface to a black cupric oxide. Since they react exclusively with the copper at the surface, a copper-rich surface favors the formation of a black deposit in the shortest time.

3 - ALKALINE AQUEOUS - The oxidizing treatment of the copper plate is to be carried out by treating the copper plate surface with an alkaline aqueous solution containing an oxidizing agent, for which agent such chlorate as sodium chlorite NaClO.sub.2 or the like, potassium persulfate K.sub.2 S.sub.2 O.sub.8. Use a concentration range of the respective components as 30-90g/1 for NaC1O.sub.2, 10-20g/1 for NaOH, and 5-15g/1 for Na.sub.3 PO.sub.4, preferably, under such treating conditions of solution temperature and treating time as 60-95 C. and 2-5 minutes, preferably.

4 - SODIUM CHLORITE + SODIUM HYDROXIDE + SODIUM PHOSPHATE - Copper was  preliminarily treated by dipping in a copper chloride solution at 25? C for 25 seconds, the solution having been prepared by mixing 2.4 kg of cupric chloride (CuCl.sub.2.2H.sub.2 O) and 18 lit. of industrial hydrochloric acid (35 wt. %) into water of 42 lit., the plates were thereafter rinsed, dipping them for 60 seconds in a hydrochloric acid solution prepared by mixing 70 lit. of the industrial hydrochloric acid (35 wt. %) with water of 155 lit., and rinsing them again. The copper was then dipped for 2 minutes in a blackening treatment solution of 95? C, the solution having been prepared in a composition of 31g/1 of sodium chlorite, 15g/1 of sodium hydroxide and 12g/1 of sodium phosphate, and the copper plates were thus blackened. The copper plates were further rinsed and dried at 120? C for 60 minutes.

5 - NaOH - Dissolve a small amount of NaOH in water and immerse the copper wire. If no color change takes place fast then add a bit more of the NaOH. Do this until you see the color change on the copper. Be sure not to get any on your skin or in your eyes and avoid breathing the fumes when dissolving the NaOH as these can hurt your lungs.

6 - "EBONOL C" #1 - Copper, if not already clean, is cleaned by immersion for typically 3 minutes in an alkaline cleaner liquid at elevated temperature of typically about 180? F and obtained by admixing "ENPLATE" 453 cleaner concentrate with water, in amount sufficient to form the alkaline cleaner liquid of about 50% by volume cleaner concentrate concentration. The copper is then water rinsed. The clean copper is then immersed in a deoxidizer liquid for typically 1-3 minutes at room temperature of the liquid and obtained by admixing "ENPLATE" AD 482 deoxidizer concentrate in water in amount sufficient to form the deoxidizer liquid of about 30% by volume deoxidizer concentrate concentration. The copper is then water rinsed.
The thus-treated clean copper, is then immersed in a blackener solution comprising 1 1/2 lbs. of "EBONOL C" blackener concentrate per gallon of water, for about 1 to 10 minutes at a solution temperature in the range of about 140? F. to about 220? F. The blackener concentrate contains a mixture of an alkali metal hydroxide, e.g. sodium hydroxide and an alkali metal chlorite, e.g. sodium chlorite. A black or dark film or coating of thickness within the range of about 0.01 mil to about 0.5 mil is thereby formed on the copper surface. The copper is then water rinsed.
The blackening solutions employed herein are those obtained by mixing 1 1/2 lbs. of either of the solid blackener concentrates A and B which follow, per gallon of water.
Blackener Concentrate A by Weight: Sodium hydroxide 66% and Sodium chlorite 34%
Blackener Concentrate B by Weight: Sodium hydroxide 50% and Sodium chlorite 50%

7 - "EBONOL C" #2 - Cupric oxide coating is formed by the method described in ASTM (American Society for Testing and Materials) Designation D
2651-79(Reapproved 1984), page 170, for forming cupric oxide coatings on copper. Copper is degreased and then immersed in a solution of 10 parts nitric acid to 90 parts water for 30 seconds at room temperature. The copper is then rinsed in running water and immersed immediately in a solution of water and Ebonol C (containing 24 ounces of "Ebonol C" per gallon of solution) for one to two minutes at 98 degrees C. "Ebonol C" is available from Ethone, Inc., New Haven, Conn. The copper is removed from the solution and rinsed in water.

8 - "EBONOL C" #3 - A copper surface dipped 5 minutes in "EBONOL C" blackener solution at 175? F. produced a coating on the surface.

9 - SULFIDE COMPOUND - The blackening agent for the second layer can easily be prepared using a sulfide compound. Many blackening agents are commercially available. "Copper black CuO", "Copper black CuS", and selenium series "Copper black No. 65" (each, trade name; product of Isolate Chemical) and "Ebonol C Special" (trade name; product of Meltex) are usable.

10 - TEMPERATURE - We have been studying copper oxidation for over two years to determine the complex reactions involved in copper oxidation at room
temperature to 500 C. Between room temperature and 100 C copper forms a thin Cu2O layer; at about 150 C a complex oxide forms Cu3O2; and at 200-300 C CuO forms. Significant oxidation occurs when CuO begins to form. You should cool copper to below 150 C to be sure that only a protective thin film has formed.

11 - AMMONIUM CHLORIDE (sal ammoniac) -  A saturated solution of commercial sal ammoniac is brush-or spray-applied. Several applications may be required to obtain the desired result.

12 - CUPROUS CHLORIDE/HYDROCHLORIC ACID - Apply by spray or brush. Consists of the following formulation:

164 g. cuprous chloride
117 ml. hydrochloric acid
69 ml. glacial acetic acid
80 g. ammonium chloride
11 g. arsenic trioxide
Water to make one (1) liter

13 - AMMONIUM SULFATE - Spray apply, six to eight applications. Consists of the following formulation:

111 g. ammonium sulfate
3.5 g. copper sulfate
1.6 ml. ammonia
1 liter water

14 - AQUEOUS SOLUTIONS - Two to ten percent aqueous solutions of ammonium sulfide, potassium sulfide (liver of sulfur), or sodium sulfide (liquid sulfur)
are swabbed or brushed on the surfaces to be treated producing the oxidized finish.

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I also need a scope to test the wire and coils with, so I've ordered one.

tak

[tak22]

here's a very interesting and encouraging quote I've taken from an Oregon newspaper where William Barbat alludes to the continuing pursuit of his patent

Unknown to almost everyone, a revolutionary non-nuclear solution is being experimented with, albeit at a slow pace.

original article from the Lake Oswego News, Jan 3/08  http://www.lakeoswegoreview.com/opinion/story.php?story_id=119932570676675000



I'm still waiting for my new DSO to be delivered, meantime I'm clearing a work space for this project in my basement, and continuing to do on-line research.

Does anyone have any progress to report? I don't mind if you're sitting back waiting for me.

tak